工艺整合研发工程师/专家(J13619)

1.Be responsible for the design and development of the device architecture of 3D NAND Flash, and deeply participate in the whole process from concept design to mass production. Utilize professional knowledge to carry out innovation at the architecture level, optimize the structure of memory cells, and improve storage density, performance and reliability. 2.Collaborate with the circuit design team …… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。

本站当前在招 238 个武汉技术研发岗位，其中 20 个公开标注了薪资。按这些标注统计：月薪（税前）主流区间 12K ~ 24K（25~75 分位），中位约 15K，最低 5K、最高 35K。