Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)

Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Overview Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP& BGA , SiP module, EMIB, CoWoS,…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。