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TW_汽車電子封裝_Packaging Development Engineer (ASIC)

博世集团📍 台北招聘
🎯 社招 来源:企业招聘门户(SmartRecruiters多租户)
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岗位描述(节选)

We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。

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