Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level chip scale package, flip-chip, multi-chip module LGA and power device packaging. Strong understanding on wafer processing such as Cu Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Cu pillar bumping techn…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。

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