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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die ( Experienced in Power or Gan is requried )

瑞萨电子📍 台北招聘
🎓 Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Eng 🧭 >10 years 🎯 社招 来源:企业招聘门户(SmartRecruiters多租户)
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岗位描述(节选)

Key Responsibilities • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). • Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. • Work with Product groups and Reliabi…… 完整岗位描述与官方投递入口,请登录后在岗位详情页查看。

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